PRODUCT CAPABILITIES

BOARD TYPES


• Single and Double Sided

• Multilayers to 8 Layers

• Through Hole and Surface Mount technology

• Heavy Copper to 4 ounce

• Plated Slots and Edges

END ITEM CAPABILITIES


• Board Thickness from .008 to .125

• Lines and Spacing down to .006

• SMT Pitch to 25 mil

• Min. Finished Hole size .012

FINAL FINISHES


• Solder Mask over Bare Copper (SMOBC)

• Hot Air Solder Leveled

• Entek

• Immersion (Electroless) full surface Nickel Gold

SOLDER MASKS


• Wet Mask - Matt or Gloss

• Liquid Photo Imageable - LPI

MATERIAL TYPES


• FR-4, CEM 1 and CEM 3

• Polyimide

• Teflon

• Flex (Kapton)

TESTING


• Single Sided test fixtures

• Double Sided Clam Shell

• Net List Testing

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